Thermomagnetic Convection in Square and Shallow Enclosures for Electronics Cooling

标题
Thermomagnetic Convection in Square and Shallow Enclosures for Electronics Cooling
作者
关键词
-
出版物
NUMERICAL HEAT TRANSFER PART A-APPLICATIONS
Volume 55, Issue 10, Pages 931-951
出版商
Informa UK Limited
发表日期
2009-05-09
DOI
10.1080/10407780902925440

向作者/读者发起求助以获取更多资源

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now