Effect of downscaling nano-copper interconnects on the microstructure revealed by high resolution TEM-orientation-mapping

标题
Effect of downscaling nano-copper interconnects on the microstructure revealed by high resolution TEM-orientation-mapping
作者
关键词
-
出版物
NANOTECHNOLOGY
Volume 23, Issue 13, Pages 135702
出版商
IOP Publishing
发表日期
2012-03-15
DOI
10.1088/0957-4484/23/13/135702

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