期刊
NANOTECHNOLOGY
卷 23, 期 48, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/0957-4484/23/48/485704
关键词
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资金
- Basic Science Research Program [2012006072]
- Future-based Technology Development Program (Nano Fields) [2011-0019168]
- National Research Foundation of Korea (NRF) [2011-0027669]
- Korean government (MEST)
- MCP Core Technologies for the Next Generation Project of Ministry of Knowledge Economy of Korea
- National Research Council of Science & Technology (NST), Republic of Korea [OD0120] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Foundation of Korea [2012R1A1A1006072, 2009-0082527, 2011R1A2A2A02649388] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
Reliable integration of solution processed nanoparticle thin films for next generation low-cost flexible electronics is limited by mechanical damage in the form of delamination and cracking of the films, which has not been investigated quantitatively or systematically. Here, we directly measured the interfacial fracture energy of silver nanoparticle thin films by using double cantilever beam fracture mechanics testing. It was demonstrated that the thermal annealing temperature and period affect the interfacial fracture energy. Also it was found that the interfacial fracture resistance can be maximized with optimized annealing conditions by the formation of organic residual bridges during the annealing process.
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