A stacked memory device on logic 3D technology for ultra-high-density data storage

标题
A stacked memory device on logic 3D technology for ultra-high-density data storage
作者
关键词
-
出版物
NANOTECHNOLOGY
Volume 22, Issue 25, Pages 254006
出版商
IOP Publishing
发表日期
2011-05-17
DOI
10.1088/0957-4484/22/25/254006

向作者/读者发起求助以获取更多资源

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started