4.8 Article

Triple Junction Transport and the Impact of Grain Boundary Width in Nanocrystalline Cu

期刊

NANO LETTERS
卷 12, 期 7, 页码 3448-3454

出版社

AMER CHEMICAL SOC
DOI: 10.1021/nl300751q

关键词

Nanocrystalline metals; grain boundary diffusion; triple junction transport; grain boundary width; atom probe tomography; CuNi

资金

  1. German Academic Exchange Service (DAAD)
  2. Deutsche Forschungsgemeinschaft [DFG: SCHM 1182/7-1, SCHM 1182/9-1, SCHM 1182/9-2]

向作者/读者索取更多资源

Triple junctions (TJ), singular topological defects of the grain boundary (GB) structure, get a dominant role for grain growth and atomic transport in nanocrystalline matter. Here, we present detailed measurements by atom probe tomography, even of the temperature dependence of TJ transport of Ni in nanocrystalline Cu in the chemical regime of interdiffusion. An unexpected variation of the effective width of merging GBs with temperature is detected. It is demonstrated that proper measurement of TJ transport requires taking into account this remarkable effect. TJ diffusion is found to be a factor of about 200 faster than GB diffusion. Its activation energy amounts to only two-thirds of that of the GB.

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