Copper(I) thiocyanate (CuSCN) as a hole-transport material for large-area opto/electronics

标题
Copper(I) thiocyanate (CuSCN) as a hole-transport material for large-area opto/electronics
作者
关键词
-
出版物
SEMICONDUCTOR SCIENCE AND TECHNOLOGY
Volume 30, Issue 10, Pages 104002
出版商
IOP Publishing
发表日期
2015-08-24
DOI
10.1088/0268-1242/30/10/104002

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