BPN a new thick negative photoresist with high aspect ratio for MEMS applications

出版年份 2012 全文链接

标题

作者

关键词

Aspect Ratio, High Aspect Ratio, Thick Copper, Negative Photoresist, Vertical Sidewall

出版物

Volume 19, Issue 3, Pages 419-423

出版商

Springer Nature

发表日期

2012-08-27

DOI

10.1007/s00542-012-1648-0

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