4.3 Article Proceedings Paper

On-chip Hot Spot Remediation with Miniaturized Thermoelectric Coolers

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MICROGRAVITY SCIENCE AND TECHNOLOGY
卷 21, 期 -, 页码 351-359

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SPRINGER
DOI: 10.1007/s12217-009-9162-4

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Thermal management; Electronic cooling; Thermoelectric cooler; Hot spot cooling

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The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in chip heat flux and growing concern over the emergence of on-chip hot spots in microprocessors, along with such high flux regions in power electronic chips and LED's. Miniaturized thermoelectric coolers (mu-TEC's) are a most promising cooling technique for the remediation of such hot spots. This paper presents a comprehensive review of recent advances in novel applications of superlattice, mini-contact, and silicon-based miniaturized thermoelectric coolers in reducing the severity of on-chip hot spots.

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