期刊
MICROELECTRONICS JOURNAL
卷 44, 期 9, 页码 860-868出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.mejo.2013.06.013
关键词
Thermoelectric cooler; Finite element methods; Size effect; Cooling performance; Response time
资金
- State Key Development Program for Basic Research of China [2012CB933200]
- National Natural Science Foundation of China [51172008, 51002006]
- National natural science fund innovation group [50921003]
- Beijing Technology Topic Program [Z111100066511009]
- Research Fund for Doctor Station
- Ministry of Education of China [20111102110035]
- Fundamental Research Funds for the Central Universities
The miniature thermoelectric cooler (TEC) is a promising device for microelectronics applications with high cooling performance and short response time. In this paper, a comprehensive numerical analysis focusing on the cooling performance and response time of the TEC is performed by finite element methods (FEMs). The effects of load current, geometric size, ratio of length to cross-sectional area and substrates thermal resistance on the performance of the TEC are studied. The results show that the performance of TECs has been improved by reducing the TEC's size and ratio of length to cross-sectional area, resulting in a maximum cooling temperature difference of 88 degrees C, a cooling power density of 1000W cm(-2) and a short response time on the order of milliseconds. Furthermore, the substrate, which hinders the circulation of heat between the TEC and the atmosphere, also has a significant influence on the performance of the TEC. (C) 2013 Elsevier Ltd. All rights reserved.
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