Skin cooling and other challenges in future mobile form factor computing devices

In this paper, we describe several of the cooling challenges in the notebook space as well as outline techniques for evaluating the benefit of new thermal technologies. Some of the challenges described in this paper include thermodynamic limits (total heat within the system), skin temperatures, and component temperatures other than the microprocessor. Specifically, in this paper we will describe a new technology for better cooling skins called laminar wall jets. This technology is useful in reducing bottom skin temperatures of notebooks by up to 20%. (C) 2007 Elsevier Ltd. All rights reserved.