期刊
MICROELECTRONIC ENGINEERING
卷 115, 期 -, 页码 32-38出版社
ELSEVIER
DOI: 10.1016/j.mee.2013.10.022
关键词
Capacitive accelerometer; Highly symmetrical structure; 16-Beam-mass; Low cross-axis response; Three-layer silicon-silicon bonding
资金
- NSFC [41074129]
- National High Technology Research and Development Program of China [2012AA061102]
A novel sandwich capacitive accelerometer with a double-sided, 16-beam-mass structure is presented. In this design, the proof mass is supported by 16 tiny beams distributed uniformly on both sides, which aims to dramatically reduce the cross-axis response. Parameters of the beam-mass structure are analyzed and optimized by analytical modeling and the finite element analysis (FEA) method. The micro-accelerometer is fabricated by bulk micromachining technology, and the proof mass and tiny beams are released by KOH anisotropic wet etching from both sides of the silicon wafer, simultaneously. The resonance frequency and the quality factor of the accelerometer are 4.34 kHz and 311, respectively, which are measured in an open-loop system. The measurement results show that the accelerometer has a full-scale (FS) range of 30 g, a close-loop sensitivity of 80 mV/g, and a nonlinearity of 0.27% of FS. The cross-axis sensitivities are 0.353% (x/z axis) and 0.045% (y/z axis), respectively. The bias stability is 0.63 mg for an hour. The accelerometer can withstand high shock of over 10,000 g. (C) 2013 Elsevier B.V. All rights reserved.
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