Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers

标题
Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 88, Issue 1, Pages 64-71
出版商
Elsevier BV
发表日期
2010-09-03
DOI
10.1016/j.mee.2010.08.022

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