Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

标题
Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 87, Issue 11, Pages 2382-2390
出版商
Elsevier BV
发表日期
2010-04-24
DOI
10.1016/j.mee.2010.04.013

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