Effects of a magnetic field on the copper metallization using the electroplating process

标题
Effects of a magnetic field on the copper metallization using the electroplating process
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 85, Issue 2, Pages 308-314
出版商
Elsevier BV
发表日期
2007-07-13
DOI
10.1016/j.mee.2007.06.018

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