期刊
MEDICAL ENGINEERING & PHYSICS
卷 33, 期 8, 页码 973-979出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.medengphy.2011.03.006
关键词
Biosensor; Integrated circuit; Prototype; Assembly; Packaging; Partial encapsulation
资金
- UK Engineering and Physical Sciences Research Council (EPSRC)
- University of Bath
- Engineering and Physical Sciences Research Council [GR/S08237/01] Funding Source: researchfish
Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (<4 mm(2)) sensor area. (C) 2011 IPEM. Published by Elsevier Ltd. All rights reserved.
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