4.4 Article

An analytical model for shear-enhanced adhesiveless transfer printing

期刊

MECHANICS RESEARCH COMMUNICATIONS
卷 43, 期 -, 页码 46-49

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.mechrescom.2012.02.011

关键词

Adhesion; Shear; Transfer printing; Interfacial delamination

资金

  1. NSF [CMMI-0749028, ECCS-0824129, OISE-1043143, CMMI-0845294]
  2. DOE, Division of Materials Sciences Grant [DE-FG02-07ER46453]
  3. AFOSR-MURI [FA9550-08-1-0337]
  4. Directorate For Engineering
  5. Div Of Civil, Mechanical, & Manufact Inn [0845294] Funding Source: National Science Foundation
  6. Div Of Electrical, Commun & Cyber Sys
  7. Directorate For Engineering [824129] Funding Source: National Science Foundation

向作者/读者索取更多资源

Transfer printing is an important technique for assembling micro/nanomaterials on unusual substrates, with promising applications in the fabrication of stretchable and flexible electronics designed for use in areas such as biomedicine. The process involves retrieval of structures (e.g., micro-devices) from their growth (donor) substrate via an elastomeric stamp (i.e.. an element with posts on its surface), and then delivers them onto a different (receiver) substrate. An analytical mechanics model is developed to identify the key parameters for a shear-enhanced mode for transfer printing. The results predict that the pull-off force decreases linearly with increasing shear strain in the post, or with shear displacement across the stamp. This prediction agrees well with the experiments. Published by Elsevier Ltd.

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