Direct Bonding to Aluminum with Silver-Oxide Microparticles

This study demonstrated that direct bonding between electrode and aluminum by using silver oxide particles which added acetic acid silver, followed by heating in air at 350 degrees C under a pressure of 2.5 MPa. Direct bonding with aluminum by using solder materials containing tin, lead, or the like has been impossible in the past. We think this technique creates strong bonding between silver and the natural oxide film formed on an aluminum surface by the combustion heat generated during oxidation of acetic acid (which is generated by decomposition of the silver acetate as it is heated). [doi: 10.2320/matertrans.MRP2008277]