期刊
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
卷 166, 期 1, 页码 99-103出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.mseb.2009.10.021
关键词
Seebeck coefficient; Electrical resistivity; Thermal conductivity; Grain boundaries; Phonon dispersion; Figure of merit
Thermoelectric properties of half-Heusler ZrNiSn intermetallic compound were investigated. The partial substitution for Sn site in ZrNiSn by Sb is effective for the reduction of the electrical resistivity, which leads to increase the power factor of the compound. The thermal conductivity for ZrNiSn0.98Sb0.02 can be reduced by the mechanical milling process maintaining the moderate Seebeck coefficient and electrical resistivity. The reduction of the thermal conductivity is ascribed to the enhancement of the phonon scattering accompanied with the minute crystal grains in the milled compounds. As a result, ZrNiSn0.98Sb0.02 with a milling time of 3 h shows a maximum ZT of 0.67 at 573 K. (C) 2009 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据