Microstructural characterization of high-manganese austenitic steels with different stacking fault energies

Microstructures of tensile-deformed high-manganese austenitic steels exhibiting twinning-induced plasticity were analyzed by electron backscatter diffraction pattern observation and X-ray diffraction measurement to examine the influence of differences in their stacking fault energies on twinning activity during deformation. The steel specimen with the low stacking fault energy of 15 mJ/m(2) had a microstructure with a high population of mechanical twins than the steel specimen with the high stacking fault energy (25 mJ/m(2)). The < 111 > and < 100 > fibers developed along the tensile axis, and mechanical twinning occurred preferentially in the < 111 > fiber. The Schmid factors for slip and twinning deformations can explain the origin of higher twinning activity in the < 111 > fiber. However, the high stacking fault energy suppresses the twinning activity even in the < 111 > fiber. A line profile analysis based on the X-ray diffraction data revealed the relationship between the characteristics of the deformed microstructures and the stacking fault energies of the steel specimens. Although the variation in dislocation density with the tensile deformation is not affected by the stacking fault energies, the effect of the stacking fault energies on the crystallite size refinement becomes significant with a decrease in the stacking fault energies. Moreover, the stacking fault probability, which was estimated from a peak-shift analysis of the 111 and 200 diffractions, was high for the specimen with low stacking fault energy. Regardless of the difference in the stacking fault energies of the steel specimens, the refined crystallite size has a certain correlation with the stacking fault probability, indicating that whether the deformation-induced crystallite-size refinement occurs depends directly on the stacking fault probability rather than on the stacking fault energies in the present steel specimens. (C) 2011 Elsevier Inc. All rights reserved.