Article
Materials Science, Multidisciplinary
Y. Cui, J. W. Xian, A. Zois, K. Marquardt, H. Yasuda, C. M. Gourlay
Summary: The factors affecting the nucleation and morphology of large Ag3Sn plates in solder joints are not well understood. This study investigates the faceted solidification of Ag3Sn and reveals transitions from single crystal plates to cyclic twinned plates and highly branched structures. Real-time X-ray imaging confirms that Ag3Sn cyclic twins originate from a common point during nucleation or the early stages of growth. Soldering to copper substrates catalyzes Ag3Sn nucleation through constitutional supercooling and geometrical catalysis.
Article
Engineering, Electrical & Electronic
Zeyu Yuan, Yujie He, Ruize Wu, Ming Xu, Jun Zhang, Yunqing Zhu, Qiaoli Wang, Weibin Xie, Huiming Chen
Summary: In this study, the addition of trace amount of rare earth Tb in Sn-3.5Ag-0.5Cu solder was found to delay the formation of IMCs and result in thinner IMC layers. The addition of 0.025 wt% Tb improved shear strength and wettability, while slowing down IMC growth, thus extending the reliability of the joint interface and the service life of the solder joint.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2022)
Article
Materials Science, Multidisciplinary
Jia Sun, Huaxin Liang, Shaofu Sun, Juntao Hu, Chunyu Teng, Lingyan Zhao, Hailong Bai
Summary: In comparison to toxic Pb-based solders, the SAC family of alloys have strong reliability and are widely used in the electronics industry. This study investigated the formation mechanism of special microstructural patterns on the surface of SAC305 solder products. It was found that the patterns were Sn-rich and exhibited the characteristic morphology of spinodal decomposition. This discovery provides theoretical support for controlling the microstructure of solder alloys and improving product quality.
Article
Materials Science, Multidisciplinary
Yubin Kang, Jin-Ju Choi, Dae-Guen Kim, Hyun-Woo Shim
Summary: This study investigated the effects of adding Bi and Zn on the mechanical properties of Sn-Ag-Cu lead-free alloy. The results showed that adding Bi and Zn could increase the tensile strength of the alloy while decreasing its electrical conductivity and elongation at break. It was found that adding Bi could reduce the activation energy required for the formation of intermetallic compounds, while adding Zn could refine the grain structure.
Article
Engineering, Electrical & Electronic
Ruyu Tian, Yanhong Tian, Yilong Huang, Dongsheng Yang, Cheng Chen, Huhao Sun
Summary: The study investigated the interfacial reactions, growth behavior of IMCs, and their effects on the mechanical properties of SAC305/ENEPIG and SAC305/ENIG solder joints under extreme temperature thermal shock. The results showed that the growth rate of IMCs in SAC305/ENEPIG joints was slower due to the inhibitory effect of the Pd(P) layer on the surface finish, resulting in higher shear force after thermal shock.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2021)
Article
Engineering, Electrical & Electronic
Zhai Xinmeng, Li Yuefeng, Zou Jun, Shi Mingming, Yang Bobo, Li Yang, Guo Chunfeng, Hu Rongrong
Summary: The study found that a soldering temperature of 270 degrees Celsius resulted in the lowest void ratio in the LED filament solder joint during reflow soldering, leading to lower steady-state voltage and junction temperature. As the void density decreased in the solder joint, the shear strength increased, resulting in higher shear resistance and mechanical reliability of the solder joint.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Metallurgy & Metallurgical Engineering
Wen -jing Chen, Nan Ye, Hai-ou Zhuo, Jian-cheng Tang
Summary: By studying the corrosion behavior and electrochemical behavior of Zn-30Sn-2Cu-xNi lead-free solder alloys in NaCl solution, it was found that the addition of 0.5 wt.% Ni can improve the corrosion resistance of the alloy by forming a better corrosion layer as a physical barrier. As the Ni content increases, the corrosion resistance of the alloy decreases, mainly due to galvanic corrosion accelerating the dissolution of the Zn-rich phase.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
(2023)
Article
Materials Science, Multidisciplinary
Yuan Wang, Xiu-Chen Zhao, Ying Liu, Yong Wang, Dong-Mei Li
Summary: The research demonstrates that adding small amounts of cerium (Ce) to Sn-3.3Ag-0.2Cu-4.7Bi solder can refine the microstructure, increase wettability, and reduce the growth rate of interfacial intermetallic compound (IMC) during thermal cycling.
Article
Chemistry, Physical
Hossein Madanipour, Yi-Ram Kim, Choong-Un Kim, Dibyajat Mishra, Patrick Thompson
Summary: This study reveals the extreme sensitivity of microstructure evolution in Sn-Ag-Cu micro-solder joint to electromigration conditions due to kinetic competition between the growth of Ni3S4 intermetallic compound and Sn electromigration. The microstructural analysis of samples tested at different conditions shows that voiding in the solder joint only develops fully when Sn electromigration rate is significantly greater than Ni3Sn4 growth rate.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Engineering, Manufacturing
Hiroaki Tatsumi, Seiji Kaneshita, Yuki Kida, Yuji Sato, Masahiro Tsukamoto, Hiroshi Nishikawa
Summary: A novel blue diode laser soldering system was constructed and compared with an infrared diode laser soldering system. The results showed that the blue laser was able to form joints at lower power and time compared to the infrared laser, and the joint impact strength was comparable between the two lasers.
JOURNAL OF MANUFACTURING PROCESSES
(2022)
Article
Materials Science, Ceramics
Dheeraj Varanasi, Manoj Kumar Pal
Summary: This study focuses on the density and dynamic viscosity of common lead-free solder materials, especially tin-based materials. A detailed literature review on theoretical evaluation models for density and dynamic viscosity is provided.
POWDER METALLURGY AND METAL CERAMICS
(2021)
Article
Construction & Building Technology
Ivan Navarrete, Yahya Kurama, Nestor Escalona, Wernher Brevis, Mauricio Lopez
Summary: This study analyzed the influence of particle size, type of SCM, and their interactions with main mixture parameters on the viscosity of cementitious paste. The results indicate that φT has a greater impact on viscosity than particle size and interparticle force of the cementitious particles.
CEMENT AND CONCRETE RESEARCH
(2022)
Article
Mechanics
K. L. Meza-Alarcon, M. A. Quetzeri-Santiago, M. A. Neri-Flores, J. Antonio del Rio, J. R. Castrejon-Pita
Summary: In this study, the behavior and spreading dynamics of molten metallic alloy droplets were investigated. The impact behavior of five different solders was analyzed in terms of material and impact conditions. The results showed that the impact behavior could be well described by the splashing ratio and the maximum dynamic spreading contact angle. This study provides useful criteria for selecting the soldering injection speed and droplet size in industrial applications to prevent splashing during soldering or molten metal jetting.
Article
Engineering, Electrical & Electronic
Xinmeng Zhai, Yue Chen, Yuefeng Li, Jun Zou, Mingming Shi, Bobo Yang, Yang Li, Chunfeng Guo, Rongrong Hu, Qijun Bao
Summary: This study investigates the influence of different soldering temperatures on the microstructure and shear behavior of flip-chip LED chips, indicating that solder joints exhibit high shear resistance at 270 degrees Celsius. As aging progresses, the shear strength initially increases and then decreases, with cracks and voids appearing as a result.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Metallurgy & Metallurgical Engineering
Yong-dian Han, Jia-hang Yang, Lian-yong Xu, Hong-yang Jing, Lei Zhao
Summary: The Cu/SAC/Ag-GNSs/Cu sandwich joints prepared under applied current density showed homogeneous dispersion of Ag-GNSs, providing more nucleation sites and refining grains, leading to enhanced shear strength and changes in fracture mechanism.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
(2021)
Article
Materials Science, Multidisciplinary
Z. Fan, Y. Wang, Y. Zhang, T. Qin, X. R. Zhou, G. E. Thompson, T. Pennycook, T. Hashimoto
Article
Materials Science, Composites
Xiaobo Zhang, Jing Sun, Mingliang Wang, Yijie Zhang, Naiheng Ma, Haowei Wang
JOURNAL OF COMPOSITE MATERIALS
(2016)
Article
Chemistry, Applied
Zhang Xiaobo, Sun Jing, Wang Mingliang, Zhang Yijie, Ma Naiheng, Wang Haowei
JOURNAL OF RARE EARTHS
(2015)
Article
Microscopy
Jing Sun, Xiaobo Zhang, Yijie Zhang, Naiheng Ma, Haowei Wang
Article
Metallurgy & Metallurgical Engineering
Jing Sun, Xiao-bo Zhang, Qing Cai, Yi-jie Zhang, Nai-heng Ma, Hao-wei Wang
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
(2015)
Article
Chemistry, Physical
Yijie Zhang, Shouxun Ji, Zhongyun Fan
JOURNAL OF ALLOYS AND COMPOUNDS
(2017)
Article
Chemistry, Physical
Sajjad Amirkhanlou, Shouxun Ji, Yijie Zhang, Douglas Watson, Zhongyun Fan
JOURNAL OF ALLOYS AND COMPOUNDS
(2017)
Article
Engineering, Industrial
Yijie Zhang, Shouxun Ji, Geoff Scamans, Zhongyun Fan
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
(2017)
Article
Nanoscience & Nanotechnology
Xixi Dong, Yijie Zhang, Shouxun Ji
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
(2017)
Article
Engineering, Industrial
Xixi Dong, Yijie Zhang, Sajjad Amirkhanlou, Shouxun Ji
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
(2018)
Article
Materials Science, Multidisciplinary
Jing Sun, Xiaobo Zhang, Yijie Zhang, Naiheng Ma, Haowei Wang
JOURNAL OF MATERIALS SCIENCE
(2015)
Proceedings Paper
Metallurgy & Metallurgical Engineering
Yijie Zhang, Shouxun Ji, Zhongyun Fan
Article
Metallurgy & Metallurgical Engineering
Yi-jie Zhang, Ming-liang Wang, Xian-feng Li, Dong Chen, Nai-heng Ma, Hao-wei Wang
Proceedings Paper
Engineering, Manufacturing
Dong Chen, Xianfeng Li, Yijie Zhang, Naiheng Ma, Haowei Wang
MATERIALS, MECHANICAL AND MANUFACTURING ENGINEERING
(2014)
Proceedings Paper
Engineering, Civil
Dong Chen, Cong Zhou, Xianfeng Li, Yijie Zhang, Naiheng Ma
MECHANICAL ENGINEERING, MATERIALS SCIENCE AND CIVIL ENGINEERING II
(2014)
