期刊
MATERIALS & DESIGN
卷 31, 期 3, 页码 1056-1062出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2009.09.051
关键词
Lead-free; Solder paste; Rheology; Viscosity; Wall-slip; Stencil printing process
资金
- UTAR Research Fund (UTARRF)
- Henkel Technologies UK
Wall-slip plays an important role in the flow behaviour of solder paste materials. The wall-slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin liquid layer adjacent to the wall, which causes slippage. The aim of this study is to investigate the influence of the solder paste formulation on wall-slip formation and its effect on the printability of these pastes material. A wall-slip model is utilised to calculate the true viscosity and slip velocity for the lead-free solder pastes samples used in this study. The difference in the measured viscosity and the true viscosity could indicate wall-slip formation between the solder pastes and the parallel plate. Sample P1 showed a higher slip velocity compared to sample P2. The slip velocity calculated for the solder pastes could be used as a performance indicator to understand the paste release characteristics in the stencil printing process. (C) 2009 Elsevier Ltd. All rights reserved.
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