Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper

标题
Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper
作者
关键词
Stacking fault tetrahedra, Nano-cutting, Molecular dynamics, Dislocation nucleation
出版物
APPLIED SURFACE SCIENCE
Volume 355, Issue -, Pages 1153-1160
出版商
Elsevier BV
发表日期
2015-07-11
DOI
10.1016/j.apsusc.2015.06.176

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