Effect of copper emitted from wafers on etch rates of insulator films in capacitively coupled fluorocarbon plasma

标题
Effect of copper emitted from wafers on etch rates of insulator films in capacitively coupled fluorocarbon plasma
作者
关键词
-
出版物
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
Volume 27, Issue 1, Pages 1-8
出版商
American Vacuum Society
发表日期
2009-01-08
DOI
10.1116/1.3006029

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