Study of Substrate Preheating on Flattening Behavior of Thermal-Sprayed Copper Particles

In this study, the effect of substrate preheating on flattening behavior of thermal-sprayed particles was systematically investigated. A part of mirror-polished AISI304 substrates were preheated to 573 and 773 K for 10 min, and then exposed to an air atmosphere for different durations of up to 48 h, respectively. Contact angle of water droplet was measured on the substrate under designated conditions. It was found that the contact angle increased gradually with the increase of substrate duration after preheating. Moreover, smaller contact angle was maintained on the substrate with higher preheating temperature. Commercially available Cu powders were thermally sprayed onto the substrates with the same thermal treatment history as contact angle measurement using atmospheric plasma-spray technique. The splat shape had a transitional changing tendency from a splash splat to a disk one on the substrate with a short duration after preheating, while reappearance of splash splat with the increase of duration was confirmed. In general, wetting of substrate surface by molten particles may dominate the flattening behavior of thermal-sprayed particles. The occurrence of desorption of adsorbed gas/condensation caused by substrate preheating likely provides good wetting. On the other hand, the poor wetting may be attributed to the re-adsorption of gas/condensation on the substrate surface with the increase of duration. In addition, the shear adhesion strength of coating fabricated on blasted AISI304 substrate was enhanced on the once-heated substrate, but weakened with the increase of duration. The changing tendency of the coating adhesion strength and the wetting of substrate by droplet corresponded quite well with each other.