Effect of the TiC content on microstructure and thermal properties of Cu–TiC composites prepared by powder metallurgy

标题
Effect of the TiC content on microstructure and thermal properties of Cu–TiC composites prepared by powder metallurgy
作者
关键词
Hot pressing, Cu–TiC, Microstructure, Thermal properties, Electrical conductivity
出版物
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
Volume 117, Issue 3, Pages 1277-1283
出版商
Springer Nature America, Inc
发表日期
2014-07-09
DOI
10.1007/s10973-014-3900-6

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search