Novel organic-inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review
出版年份 2015 全文链接
标题
Novel organic-inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review
作者
关键词
-
出版物
POLYMER COMPOSITES
Volume 38, Issue 4, Pages 803-813
出版商
Wiley
发表日期
2015-06-23
DOI
10.1002/pc.23641
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