Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers

Adsorption Behavior and Related Mechanism of Janus Green B during Copper Via-Filling Process

(2009) Ya-Bing Li et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of Reverse Pulse on Copper Fill

(2009) Masanori Hayase et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide

(2009) Wei-Ping Dow et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

The process and pastes for the via hole plugging of HDI PCBs

(2008) Manfred Suppa   CIRCUIT WORLD

Enhanced Electrodeposition of Cu into Recessed Features via Topographically Selective Ozonolysis of Adsorbed Accelerator

(2008) Stephen Mazur et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Blocking of Disulfide Adsorption by Coadsorbing ω-Functionalized Alkane Thiols Revealed by Wet Stamping and Fluorescence Microscopy

(2008) Christopher J. Campbell et al.   LANGMUIR

3-Mercapto-1-propanesulfonic acid and Bis(3-sulfopropyl) Disulfide Adsorbed on Au(111): In Situ Scanning Tunneling Microscopy and Electrochemical Studies

(2008) Zheng-Yan Jian et al.   LANGMUIR

Enhancement of filling performance of a copper plating formula at low chloride concentration

(2007) Wei-Ping Dow et al.   ELECTROCHIMICA ACTA