Tungsten Nitrido Complexes as Precursors for Low Temperature Chemical Vapor Deposition of WNxCy Films as Diffusion Barriers for Cu Metallization

标题
Tungsten Nitrido Complexes as Precursors for Low Temperature Chemical Vapor Deposition of WNxCy Films as Diffusion Barriers for Cu Metallization
作者
关键词
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出版物
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY
Volume 136, Issue 4, Pages 1650-1662
出版商
American Chemical Society (ACS)
发表日期
2014-01-03
DOI
10.1021/ja4117582

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