期刊
JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN
卷 45, 期 5, 页码 365-376出版社
PROFESSIONAL ENGINEERING PUBLISHING LTD
DOI: 10.1243/03093247JSA587
关键词
high-resolution electron backscatter diffraction; scanning electron microscopy; diffraction patterns; microscale deformation
资金
- Engineering and Physical Sciences Research Council [EP/C509870/1, EP/E044778/1]
- Rolls-Royce plc
- Corus
- EPSRC [EP/E044778/1] Funding Source: UKRI
Electron backscatter diffraction (EBSD) is a widely available and relatively easy-to-use scanning-electron-microscopy-based diffraction technique. Recently, Wilkinson, Meaden, and Dingley presented two papers on a new cross-correlation-based analysis of EBSD patterns which allow variations in the elastic strain and lattice rotation tensors to be measured at a sensitivity of about 10(-4) at high spatial resolution. This paper briefly describes the basis of the technique and how the resulting lattice curvatures can be used to estimate the geometrically necessary dislocation (GND) content in a sample. To illustrate the utility of the method for microscale deformation studies the following examples are described: first, nanoindentation near a grain boundary in alpha-Ti; second, transformation-induced GNDs in a dual-phase steel; third, thermally-induced and mechanically-induced deformation near carbides in a superalloy; fourth, GND accumulation during fatigue of a polycrystalline Ti-6Al-4V alloy.
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