Microstructure formation via roll-to-roll UV embossing using a flexible mould made from a laminated polymer–copper film

标题
Microstructure formation via roll-to-roll UV embossing using a flexible mould made from a laminated polymer–copper film
作者
关键词
-
出版物
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 22, Issue 8, Pages 085010
出版商
IOP Publishing
发表日期
2012-07-05
DOI
10.1088/0960-1317/22/8/085010

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