Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording

出版年份 2012 全文链接

标题

Soldering-based easy packaging of thin polyimide multichannel electrodes for neuro-signal recording

作者

关键词

-

出版物

JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Volume 22, Issue 11, Pages 115017

出版商

IOP Publishing

发表日期

2012-09-27

DOI

10.1088/0960-1317/22/11/115017

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