Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds

标题
Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds
作者
关键词
-
出版物
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 21, Issue 1, Pages 017002
出版商
IOP Publishing
发表日期
2010-12-22
DOI
10.1088/0960-1317/21/1/017002

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