Processing and quantitative analysis of biodegradable polymers (PLLA and PCL) thermal bonding

标题
Processing and quantitative analysis of biodegradable polymers (PLLA and PCL) thermal bonding
作者
关键词
-
出版物
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 20, Issue 8, Pages 085006
出版商
IOP Publishing
发表日期
2010-07-03
DOI
10.1088/0960-1317/20/8/085006

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