A full-wafer fabrication process for glass microfluidic chips with integrated electroplated electrodes by direct bonding of dry film resist

标题
A full-wafer fabrication process for glass microfluidic chips with integrated electroplated electrodes by direct bonding of dry film resist
作者
关键词
-
出版物
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 19, Issue 7, Pages 077001
出版商
IOP Publishing
发表日期
2009-06-24
DOI
10.1088/0960-1317/19/7/077001

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