Evaluation of different PDMS interconnection solutions for silicon, Pyrex and COC microfluidic chips

标题
Evaluation of different PDMS interconnection solutions for silicon, Pyrex and COC microfluidic chips
作者
关键词
-
出版物
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 18, Issue 5, Pages 055012
出版商
IOP Publishing
发表日期
2008-04-02
DOI
10.1088/0960-1317/18/5/055012

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