Low-temperature bonding of poly-(methyl methacrylate) microfluidic devices under an ultrasonic field

标题
Low-temperature bonding of poly-(methyl methacrylate) microfluidic devices under an ultrasonic field
作者
关键词
-
出版物
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 19, Issue 1, Pages 015035
出版商
IOP Publishing
发表日期
2008-12-20
DOI
10.1088/0960-1317/19/1/015035

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