期刊
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 22, 期 6, 页码 1470-1477出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2013.2265851
关键词
Borosilicate glass; glass etching; silicon molding; anodic bonding; vertical interconnect; glass reflow; glass molding
类别
资金
- Engineering Research Centers Program of the National Science Foundation [EEC-9986866]
This paper reports a new batch-mode fabrication process that combines glass and silicon into a single wafer. The technique requires only a single mask to lithographically define recesses in silicon using deep reactive ion etching. The patterned silicon wafer is anodically bonded to a glass wafer, and a high-temperature step reflows the glass into this silicon mold. The reflowed wafer stack is then planarized and thinned. Through-glass vias can be realized in this manner while additional process-flow modifications enable features such as molded cavities in the glass. A capacitive pressure sensor and a hermetically sealed resonator are described to illustrate applications of the process. Finally, a three dimensional packaging technique for implantable biomedical microsystems is shown by vertically stacking glass-in-silicon wafers.
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