Fabrication of Flexible Transducer Arrays With Through-Wafer Electrical Interconnects Based on Trench Refilling With PDMS

标题
Fabrication of Flexible Transducer Arrays With Through-Wafer Electrical Interconnects Based on Trench Refilling With PDMS
作者
关键词
-
出版物
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 17, Issue 2, Pages 446-452
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2008-04-10
DOI
10.1109/jmems.2008.918381

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