Design of flexible copper clad laminate with outstanding adhesion strength induced by chemical bonding

Novel phthalonitrile-terminated polyarylene ether nitrile with high glass transition temperature and enhanced thermal stability

(2014) Lifen Tong et al.   MATERIALS LETTERS

Crosslinking behavior of polyarylene ether nitrile terminated with phthalonitrile (PEN-t-Ph)/1,3,5-Tri-(3,4-dicyanophenoxy) benzene (TPh) system and its enhanced thermal stability

(2013) Lifen Tong et al.   JOURNAL OF APPLIED POLYMER SCIENCE

Effect of curing behaviors on the properties of poly(arylene ether nitrile) end-capped with phthalonitrile

(2012) Yanke Zou et al.   JOURNAL OF APPLIED POLYMER SCIENCE

Copolymerizing behavior and processability of benzoxazine/epoxy systems and their applications for glass fiber composite laminates

(2012) Mingzhen Xu et al.   JOURNAL OF APPLIED POLYMER SCIENCE

Cross-linkable nitrile functionalized graphene oxide/poly(arylene ether nitrile) nanocomposite films with high mechanical strength and thermal stability

(2012) Yingqing Zhan et al.   JOURNAL OF MATERIALS CHEMISTRY

Stoichiometry-Controlled Fabrication of CuxS Hollow Structures With Cu2O as Sacrificial Templates

(2011) Dong-Feng Zhang et al.   CRYSTAL GROWTH & DESIGN

High-performance PEN/GF crosslinkable thermoplastic composites: preparation, properties, and crosslinking reaction

(2011) Jian Yang et al.   JOURNAL OF COMPOSITE MATERIALS

Design of thorn-like micro/nanofibers: fabrication and controlled morphology for engineered composite materials applications

(2011) Fanbin Meng et al.   JOURNAL OF MATERIALS CHEMISTRY

Effect of thermal treatment on adhesion strength of Cu/Ni–Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process

(2010) Bo-In Noh et al.   MICROELECTRONIC ENGINEERING

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

(2008) Bo-In Noh et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS