Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate

标题
Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate
作者
关键词
Water Contact Angle, DMSO Solution, Electroless Plating, Copper Layer, Copper Film
出版物
出版商
Springer Nature
发表日期
2013-01-22
DOI
10.1007/s10854-013-1081-x

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started