Influence of minor POSS molecules additions on the microstructure and hardness of Sn3Ag0.5Cu–xPOSS composite solders

出版年份 2012 全文链接

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作者

关键词

出版物

Volume 23, Issue 9, Pages 1640-1646

出版商

Springer Nature

发表日期

2012-02-07

DOI

10.1007/s10854-012-0641-9

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