Thermal expansion coefficient and thermal fatigue of discontinuous carbon fiber-reinforced copper and aluminum matrix composites without interfacial chemical bond

Influence of the interface structure on the thermo-mechanical properties of Cu–X (X=Cr or B)/carbon fiber composites

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Multi-Walled Carbon Nanotube-Aluminum Matrix Composites Prepared by Combination of Hetero-Agglomeration Method, Spark Plasma Sintering and Hot Extrusion

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Engineering Strong Intergraphene Shear Resistance in Multi-walled Carbon Nanotubes and Dramatic Tensile Improvements

(2009) Mehdi Estili et al.   ADVANCED MATERIALS

Architectural optimization for microelectronic packaging

(2009) Jean-Denis Mathias et al.   APPLIED THERMAL ENGINEERING

Novel processing and characterization of Cu/CNF nanocomposite for high thermal conductivity applications

(2009) J.F. Silvain et al.   COMPOSITES SCIENCE AND TECHNOLOGY

Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

(2009) Hui Xu et al.   JOURNAL OF ELECTRONIC MATERIALS

Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier

(2009) Seongjun Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE

Heat Sink Material Selection in Electronic Devices by Computational Approach

(2008) P.-M. Geffroy et al.   ADVANCED ENGINEERING MATERIALS

Heat dissipation effect of Al plate embedded substrate in network system

(2008) Seung Hyun Cho   MICROELECTRONICS RELIABILITY

High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization

(2008) Rolf Johannessen et al.   MICROELECTRONICS RELIABILITY

Thermal management of electronics: A review of literature

(2008) Sundaram Anandan et al.   Thermal Science