Gas flow sputtering: Versatile process for the growth of nanopillars, nanoparticles, and epitaxial thin films

Gas flow sputtering is a sputter-deposition method that enables soft and high-rate deposition even for oxides or nitrides. It involves sputtering at a high pressure of around 100 Pa and hollow cathode discharge in a tubular or parallel plate target with forced Ar flow. Depending on the sputtering conditions, various structures of magnetic materials are obtained, and some examples are shown in this paper. Co-Pt and Fe nanopillars are fabricated using a tubular target with a large inner diameter (6-40 mm). Fe nanoparticles with diameters ranging from a few nanometers to 150 nm are fabricated using a tubular target with a small inner diameter (5 mm). Magnetite epitaxial thin films are fabricated on MgO and GaAs substrates by substrate heating. (C) 2008 Elsevier B.V. All rights reserved.