Direct-write Assembly of Ceramic Three-dimensional Structures Based on Photosensitive Inks

A novel kind of photosensitive ceramic inks was developed for Direct-Write Assembly and a BaTiO3 based woodpile structure with filament diameter of about 300 mu m was fabricated through this method. The preparation of the photosensitive inks, the principle of the Direct Ink Write (DIW) and the sintering schedule were investigated. ne analyses at different states ill the process show that the BaTiO3 particles keep monodisperse before sintering, which ensures a feasible extrusion of the ink. Moreover, the sintered products exhibit a fine ceramic forming result and isotropic contraction, with little deformation and few cracks. As a powerful molding technique, the MW has merits of rapid processing and good compatibility with various materials.