4.7 Article

Adhesives formulated with chemically modified okara and phenol-resorcinol-formaldehyde for bonding fancy veneer onto high-density fiberboard

期刊

出版社

ELSEVIER SCIENCE INC
DOI: 10.1016/j.jiec.2008.12.005

关键词

Okara; Phenol-resorcinol-formaldehyde prepolymer; Fancy veneer; High-density fiberboard; Formaldehyde emissions

资金

  1. Ministry of Agriculture and Forestry, Republic of Korea

向作者/读者索取更多资源

With an abrupt increase of petrochemical prices and the critical environmental issue related to the volatile organic compounds emitted from the adhesive resins, the development of environmentally friendly new adhesive systems is common issue. In our study, the okara, which is a residue from the production of tofu, was introduced to develop competitive bio-based adhesives for the production of fancy-veneered floor boards. Okara (AC and AK) was hydrolyzed with 1% sulfuric acid solution and 1% sodium hydroxide solution. Phenol-resorcinol-formaldehyde (PRF) prepolymer was prepared as a crosslinker of AC and AK. Adhesive resins were formulated with AC, AK and PRF prepolymer. The adhesive resins were used to fabricate floor boards composed of oak veneers onto high-density fiberboard. The experimental variables were three weight ratio of AC/AK to PRF (45/45/10,40/40/20 and 35/35/30), three assembly time (0, 10 and 20 min), and two press time (90 and 120 s), respectively. The fancy-veneered high-density fiberboards were prepared and subject to testing of the dry tensile strength, glueline failure by wetting and formaldehyde emission. Dry tensile strengths of the boards exceeded the requirement of KS standard. The formaldehyde emissions were satisfied with the limitation specified in KS standard. Based on these results, okara has a potential to be used as a renewable raw material of environmentally friendly adhesive resin systems for production of floor boards, but further researches, such as biological hydrolysis of okara and various formulations of PRF prepolymer, are required to improve the adhesive strength and to reduce formaldehyde emission of okara-based adhesive resins. (C) 2009 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据