Performance analysis of a thermoelectric cooler with a corrugated architecture

出版年份 2015 全文链接

标题

作者

关键词

Thermoelectric, TEC, Thin-film, Cooling, Heat sink, Design optimization

出版物

Volume 147, Issue -, Pages 184-191

出版商

Elsevier BV

发表日期

2015-03-14

DOI

10.1016/j.apenergy.2015.01.132

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