Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep

Fatigue crack growth in SiC particle reinforced Al alloy matrix composites at high and low R-ratios by in situ X-ray synchrotron tomography

(2014) Peter Hruby et al.   INTERNATIONAL JOURNAL OF FATIGUE

3D microstructural characterization and mechanical properties of constituent particles in Al 7075 alloys using X-ray synchrotron tomography and nanoindentation

(2014) Sudhanshu S. Singh et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Development of a lab-scale, high-resolution, tube-generated X-ray computed-tomography system for three-dimensional (3D) materials characterization

(2014) J.C.E. Mertens et al.   MATERIALS CHARACTERIZATION

Accurate modeling and reconstruction of three-dimensional percolating filamentary microstructures from two-dimensional micrographs via dilation-erosion method

(2014) En-Yu Guo et al.   MATERIALS CHARACTERIZATION

Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature

(2014) Yansong Tan et al.   MICROELECTRONICS RELIABILITY

Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder

(2013) Ying Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Creep properties of low-temperature sintered nano-silver lap shear joints

(2013) Xin Li et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Solid-solution copper alloys with high strength and high electrical conductivity

(2013) Kazunari Maki et al.   SCRIPTA MATERIALIA

Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules

(2013) Yuming Zhang et al.   SCRIPTA MATERIALIA

Quantifying the effect of porosity on the evolution of deformation and damage in Sn-based solder joints by X-ray microtomography and microstructure-based finite element modeling

(2012) E. Padilla et al.   ACTA MATERIALIA

Effects of grain boundary heterogeneities on creep fracture studied by rate-dependent cohesive model

(2012) Chi-Hua Yu et al.   ENGINEERING FRACTURE MECHANICS

Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly

(2012) Yunhui Mei et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Understanding fatigue crack growth in aluminum alloys by in situ X-ray synchrotron tomography

(2012) J.J. Williams et al.   INTERNATIONAL JOURNAL OF FATIGUE

Creep–Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures

(2012) Kittichai Fakpan et al.   JOURNAL OF ELECTRONIC MATERIALS

High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films

(2012) Gang Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force

(2012) Xin Li et al.   MICROELECTRONICS RELIABILITY

Real-time quantitative imaging of failure events in materials under load at temperatures above 1,600 °C

(2012) Hrishikesh A. Bale et al.   NATURE MATERIALS

In situ tensile creep behaviors of Sn–4Ag/Cu solder joints revealed by electron backscatter diffraction

(2012) Q.K. Zhang et al.   SCRIPTA MATERIALIA

Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

(2010) M.A. Dudek et al.   MATERIALS CHARACTERIZATION

Shear punch creep test: A novel localized method for evaluating creep properties

(2010) R. Alizadeh et al.   SCRIPTA MATERIALIA

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

(2009) Dun-ji Yu et al.   MATERIALS & DESIGN

Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste

(2008) Xu Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints

(2007) Qiang Yu et al.   MICROELECTRONICS RELIABILITY