Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates

Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

(2012) Niwat Mookam et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–0.7Cu solder alloy and copper substrate

(2012) Satyanarayan et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of soldering condition on formation of intermetallic phases developed between Sn–0.3Ag–0.7Cu low-silver lead-free solder and Cu substrate

(2011) Niwat Mookam et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

(2011) H.R. Kotadia et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys

(2011) Fangjie Cheng et al.   JOURNAL OF MATERIALS SCIENCE

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

(2010) XiaoRui Zhang et al.   CHINESE SCIENCE BULLETIN

Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy

(2009) Kannachai Kanlayasiri et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE

Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders

(2008) G. Montesperelli et al.   MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION

Reaction Properties and Interfacial Intermetallics for Sn-xAg-0.5Cu Solders as a Function of Ag Content

(2008) Jong-Hyun Lee   METALS AND MATERIALS INTERNATIONAL

The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction

(2007) D.Q. Yu et al.   JOURNAL OF ALLOYS AND COMPOUNDS