期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 42, 期 2, 页码 288-293出版社
SPRINGER
DOI: 10.1007/s11664-012-2336-7
关键词
Sn-Zn; SAC; density; surface tension; viscosity; physicochemical properties
资金
- Ministry of Science and Higher Education of Poland [630/N Kanada/2009]
Applying the discharge crucible (DC) method, the viscosity, density, and surface tension were determined for Sn-9Zn and Sn-2.92Ag-0.4Cu-3.07Bi (SAC + Bi) alloys. For comparison, the dilatometric, maximum bubble pressure, and capillary flow methods were used for measurements of these same physicochemical properties for the Sn-2.92Ag-0.4Cu-3.07Bi (SAC + Bi) alloy. The measurements were performed for Sn-9Zn and SAC + Bi alloys in the temperature range from 513 K to 723 K and 530 K to 1180 K, respectively. The experimental data obtained show that addition of Bi to SAC increases the density and decreases the surface tension and viscosity in comparison with SAC solder. Additionally it was found that the properties studied by different methods (maximum bubble pressure, dilatometric, capillary flow, and discharge crucible) were almost identical.
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