期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 39, 期 11, 页码 2412-2417出版社
SPRINGER
DOI: 10.1007/s11664-010-1336-8
关键词
Interfacial reaction; Sn-58Bi; Sn-9Zn; Au/Ni/SUS304 multilayer substrate; diffusion controlled
The liquid/solid interfacial reactions of Sn-58Bi (SB) and Sn-9Zn (SZ) lead-free solders with Au/Ni/SUS304 multilayer substrates have been investigated in this study. In the SB/Au/Ni/SUS304 couple, only the Ni3Sn4 phase with needle-like grains was formed at the SB/Au/Ni/SUS304 interface. The Ni5Zn21 phase with a column structure was formed at the SZ/Au/Ni/SUS304 interface. The thickness of both intermetallic compounds (IMCs) increased with increasing reaction temperature and time. Meanwhile, the growth mechanism of these two IMCs is seen to follow a parabolic law and is diffusion controlled.
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